MSP430FR2111 Datasheet, PDF (2/75 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430FR2111, MSP430FR2110
SLASE78A – AUGUST 2016 – REVISED AUGUST 2016
www.ti.com
1.3 Description
MSP430FR211x devices are an expansion of the MSP430™ microcontroller (MCU) value line to the
MSP430FRx FRAM-based MCU family with up to 50x the RAM of comparable 8-bit MCUs in a 3-×3-mm²
package. This ultra-low-power MCU family consists of several devices featuring embedded unified
memory, which eliminates the need for assembly programming, making it easier to upgrade 8-bit designs
in C and take advantage of the benefits of FRAM and integrated peripherals targeted at various
applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are
optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a
nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and
reliability of flash, all at lower total power consumption. Additionally, existing designs on the MSP430G2x
family can migrate to the MSP430F211x family to increase performance and get the benefits of FRAM.
The MSP430FR211x MCU features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators
that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device
to wake up from low-power modes to active mode typically in less than 10 µs. The feature-set of this MCU
meets the needs of applications ranging from smoke detectors to power tool battery protection and fitness
accessories.
PART NUMBER
Device Information⁽¹⁾
PACKAGE
BODY SIZE⁽²⁾
MSP430FR2111PW16
MSP430FR2110PW16
TSSOP (16)
5 mm × 4.4 mm
MSP430FR2111RLL
MSP430FR2110RLL
QFN (24)
3 mm × 3 mm
(1) For the most current part, package, and ordering information, see the Package Option Addendum in
Section 9, or see the TI website at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
CAUTION
System-level ESD protection must be applied in compliance with the device-
level ESD specification to prevent electrical overstress or disturbing of data or
code memory. See MSP430™ System-Level ESD Considerations for more
information.
2
Device Overview
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Product Folder Links: MSP430FR2111 MSP430FR2110