SN74AUP1G79_17 Datasheet, PDF (5/45 Pages) Texas Instruments – SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

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SN74AUP1G79
SCES592I – JULY 2004 – REVISED SEPTEMBER 2017
6.3 Recommended Operating Conditions
MIN
MAX
V_CC
Supply voltage
V_IH
High-level input voltage
V_IL
Low-level input voltage
V_I
Input voltage⁽¹⁾
V_O
Output voltage
I_OH
High-level output current
I_OL
Low-level output current
Δt/Δv
T_A
Input transition rise or fall rate
Operating free-air temperature
V_CC = 0.8 V
V_CC = 1.1 V to 1.95 V
V_CC = 2.3 V to 2.7 V
V_CC = 3 V to 3.6 V
V_CC = 0.8 V
V_CC = 1.1 V to 1.95 V
V_CC = 2.3 V to 2.7 V
V_CC = 3 V to 3.6 V
V_CC = 0.8 V
V_CC = 1.1 V
V_CC = 1.4 V
V_CC = 1.65 V
V_CC = 2.3 V
V_CC = 3 V
V_CC = 0.8 V
V_CC = 1.1 V
V_CC = 1.4 V
V_CC = 1.65 V
V_CC = 2.3 V
V_CC = 3 V
V_CC = 0.8 V to 3.6 V
0.8
V_CC
0.65 × V_CC
1.6
2
0
0
–40
3.6
0
0.35 × V_CC
0.7
0.9
3.6
V_CC
–20
–1.1
–1.7
–1.9
–3.1
–4
20
1.1
1.7
1.9
3.1
4
200
85
(1) All unused inputs of the device must be held at V_CC or GND to assure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs.
UNIT
V
V
V
V
V
µA
mA
µA
mA
ns/V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
Junction-to-ambient thermal
resistance
R_θJC(top)
Junction-to-case (top) thermal
resistance
R_θJB
Junction-to-board thermal
resistance
ψ_JT
Junction-to-top characterization
parameter
ψ_JB
Junction-to-board
characterization parameter
R_θJC(bot)
Junction-to-case (bottom)
thermal resistance
DBV
(SOT-23)
5 PINS
267.2
191.9
101.1
83.0
100.8
N/A
DCK
(SC70)
5 PINS
284.1
DRL
(SOT-5X3)
5 PINS
294.1
SN74AUP1G79
DRY
(SON)
DSF
(SON)
6 PINS 6 PINS
341.1
377.1
DPW
(X2SON)
5 PINS
489.2
YFP
(DSBGA)
6 PINS
125.4
YZP
(DSBGA)
5 PINS
146.2
UNIT
°C/W
208.5
132.5
233.1
187.7
226.3
1.9
1.4
°C/W
103.1
143.4
206.7
236.6
352.9
37.2
39.3
°C/W
76.6
14.5
63.4
29.0
38.2
0.5
0.7
°C/W
102.3
143.9
206.7
236.3
352.1
37.5
39.8
°C/W
N/A
N/A
N/A
N/A
150.8
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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