SN74AUP1G79_17 Datasheet, PDF (32/45 Pages) Texas Instruments – SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

YZP0005
EXAMPLE BOARD LAYOUT
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
5X ( 0.23)
A
(0.5) TYP
B
(0.5) TYP
1
2
SYMM
C
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
SOLDER MASK
OPENING
0.05 MAX
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
( 0.23)
METAL
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
4219492/A 05/2017
www.ti.com