SN74AUP1G79_17 Datasheet, PDF (35/45 Pages) Texas Instruments – SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

YFP0006
EXAMPLE BOARD LAYOUT
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.23)
1
2
A
(0.4) TYP
B
SYMM
C
SYMM
LAND PATTERN EXAMPLE
SCALE:50X
( 0.23)
METAL
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NOT TO SCALE
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
4223410/A 11/2016
www.ti.com