SN74AUP1G79_17 Datasheet, PDF (2/45 Pages) Texas Instruments – SN74AUP1G79 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

SN74AUP1G79
SCES592I – JULY 2004 – REVISED SEPTEMBER 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics: T_A = 25°C ........................ 6
6.6 Electrical Characteristics: T_A = –40°C to 85°C ......... 7
6.7 Timing Requirements ................................................ 8
6.8 Switching Characteristics: C_L = 5 pF ........................ 9
6.9 Switching Characteristics: C_L = 10 pF ...................... 9
6.10 Switching Characteristics: C_L = 15 pF .................. 10
6.11 Switching Characteristics: C_L = 30 pF .................. 11
6.12 Operating Characteristics...................................... 11
6.13 Typical Characteristics .......................................... 12
7 Parameter Measurement Information ................ 13
7.1 Propagation Delays, Setup and Hold Times, and
Pulse Width.............................................................. 13
7.2 Enable and Disable Times ...................................... 14
8 Detailed Description ............................................ 15
8.1 Overview ................................................................. 15
8.2 Functional Block Diagram ....................................... 15
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 16
9 Applications, Implementation, and Layout ....... 17
9.1 Application Information............................................ 17
9.2 Typical Application .................................................. 17
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1 Documentation Support ........................................ 20
12.2 Receiving Notification of Documentation Updates 20
12.3 Community Resources.......................................... 20
12.4 Trademarks ........................................................... 20
12.5 Electrostatic Discharge Caution ............................ 20
12.6 Glossary ................................................................ 20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (April 2015) to Revision I
Page
• Added DPW (X2SON) package.............................................................................................................................................. 1
• Added Maximum junction temperature, T_J in Absolute Maximum Ratings ............................................................................ 4
• Changed values in the Thermal Information table to align with JEDEC standards. .............................................................. 5
• Added Balanced High-Drive CMOS Push-Pull Outputs, Standard CMOS Inputs, Clamp Diodes, Partial Power Down
(I_off), Over-voltage Tolerant Inputs ........................................................................................................................................ 15
• Added Receiving Notification of Documentation Updates and Community Resources ....................................................... 20
Changes from Revision G (May 2010) to Revision H
Page
• Updated document to the new TI data sheet format .............................................................................................................. 1
• Removed Ordering Information table .................................................................................................................................... 1
• Added Device Information table ............................................................................................................................................ 1
• Added Typical Characteristics section.................................................................................................................................. 12
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