CD4051B-Q1_15 Datasheet, PDF (5/24 Pages) Texas Instruments – CMOS ANALOG MULTIPLEXERS/DEMULTIPLEXERS

CD4051B-Q1, CD4052B-Q1, CD4053B-Q1
CMOS ANALOG MULTIPLEXERS/DEMULTIPLEXERS
WITH LOGIC−LEVEL CONVERSION
SCHS354A − AUGUST 2004 − REVISED JANUARY 2008
logic diagrams (positive logic) (continued)
CD4053B
A^† ₁₁
B^† 10
C^† ₉
INH^† ₆
16 V_DD
Logic-Level
Conversion
Binary to
1-of-2
Decoders
With
Inhibit
IN/OUT
cy cx by bx ay ax
3 5 1 2 13 12
V_DD
COM OUT/IN
TG
ac or ay
14
TG
COM OUT/IN
TG
bc or by
15
TG
COM OUT/IN
TG
xc or xy
4
TG
8 V_SS
7 VEE
† _{All inputs are protected by standard CMOS protection network.}
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^‡
Supply voltage range, V+ to V− (voltages referenced to V_SS terminal) . . . . . . . . . . . . . . . . . . . . . . −0.5 to 20 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V_DD + 0.5 V
DC input current, any one input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Package thermal impedance, θ_JA (see Note 1): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 265°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
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