TMS320F28075 Datasheet, PDF (42/182 Pages) Texas Instruments – Microcontrollers

TMS320F28075
SPRS902B – OCTOBER 2014 – REVISED OCTOBER 2015
www.ti.com
5.6 Thermal Resistance Characteristics
5.6.1 PTP Package
°C/W ⁽¹⁾
AIR FLOW (lfm)⁽²⁾
RΘ_JC
RΘ_JB
RΘ_JA (High k PCB)
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Junction-to-free air thermal resistance
6.97
N/A
6.05
N/A
17.8
0
12.8
150
RΘ_JMA
Junction-to-moving air thermal resistance
11.4
250
10.1
500
0.11
0
Psi_JT
Junction-to-package top
0.24
150
0.33
250
0.42
500
6.1
0
Psi_JB
Junction-to-board
5.5
150
5.4
250
5.3
500
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
5.6.2 PZP Package
°C/W ⁽¹⁾
AIR FLOW (lfm)⁽²⁾
RΘ_JC
RΘ_JB
RΘ_JA (High k PCB)
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Junction-to-free air thermal resistance
4.3
N/A
5.9
N/A
19.1
0
14.3
150
RΘ_JMA
Junction-to-moving air thermal resistance
12.8
250
11.4
500
0.03
0
Psi_JT
Junction-to-package top
0.09
150
0.12
250
0.20
500
6.0
0
Psi_JB
Junction-to-board
5.5
150
5.5
250
5.3
500
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
42
Specifications
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