CC1310_16 Datasheet, PDF (40/54 Pages) Texas Instruments – SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

CC1310
SWRS181B – SEPTEMBER 2015 – REVISED OCTOBER 2015
www.ti.com
8.3 Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various
software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
Other than providing technical support forums, videos, and blogs, the Low-Power RF E2E Online
Community also presents the opportunity to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.4 Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SimpleLink, SmartRF, Code Composer Studio, E2E are trademarks of Texas Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, ARM Thumb are registered trademarks of ARM Limited (or its subsidiaries).
ULPBench is a trademark of Embedded Microprocessor Benchmark Consortium.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.
ZigBee is a registered trademark of Zigbee Alliance.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9 Mechanical Packaging and Orderable Information
9.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Mechanical Packaging and Orderable Information
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