CC1310_16 Datasheet, PDF (4/54 Pages) Texas Instruments – SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

CC1310
SWRS181B – SEPTEMBER 2015 – REVISED OCTOBER 2015
www.ti.com
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 4
3 Device Comparison ..................................... 5
4 Terminal Configuration and Functions.............. 6
4.1 Pin Diagram – RSM Package ........................ 6
4.2 Signal Descriptions – RSM Package................. 7
4.3 Pin Diagram – RHB Package ........................ 8
4.4 Signal Descriptions – RHB Package ................. 9
4.5 Pin Diagram – RGZ Package ....................... 10
4.6 Signal Descriptions – RGZ Package................ 10
5 Specifications ........................................... 12
5.1 Absolute Maximum Ratings ......................... 12
5.2 ESD Ratings ........................................ 12
5.3 Recommended Operating Conditions............... 12
5.4 Power Consumption Summary...................... 13
5.5 RF Characteristics .................................. 13
5.6 Receive (RX) Parameters........................... 14
5.7 Transmit (TX) Parameters .......................... 15
5.8 PLL Parameters..................................... 16
5.9 Thermal Characteristics............................. 17
5.10 Timing and Switching Characteristics ............... 17
5.11 Typical Characteristics .............................. 24
6 Detailed Description ................................... 28
6.1 Overview ............................................ 28
6.2 Main CPU ........................................... 28
6.3 RF Core ............................................. 29
6.4 Sensor Controller ................................... 30
6.5 Memory.............................................. 31
6.6 Debug ............................................... 31
6.7 Power Management................................. 32
6.8 Clock Systems ...................................... 33
6.9 General Peripherals and Modules .................. 33
6.10 System Architecture................................. 34
7 Application, Implementation, and Layout ......... 35
7.1 TI Design ............................................ 36
8 Device and Documentation Support ............... 37
8.1 Device Support ...................................... 37
8.2 Documentation Support ............................. 39
8.3 Additional Information ............................... 40
8.4 Trademarks.......................................... 40
8.5 Electrostatic Discharge Caution..................... 40
8.6 Glossary ............................................. 40
9 Mechanical Packaging and Orderable
Information .............................................. 40
9.1 Packaging Information .............................. 40
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from September 30, 2015 to October 23, 2015
Page
• Added the RSM and RHB packages .............................................................................................. 6
Changes from August 31, 2015 to September 30, 2015
Page
• Changed device status from: Product Preview to: Production Data ........................................................... 1
• Removed the RSM and RHB packages .......................................................................................... 6
• Changed Typical Characteristics section ........................................................................................ 24
4
Revision History
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