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BQ24765_15 Datasheet, PDF (4/43 Pages) Texas Instruments – SMBus-Controlled Multi-Chemistry Battery Charger With Integrated Power MOSFETs
bq24765
SLUS999A – NOVEMBER 2009 – REVISED NOVEMBER 2015
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PIN
NAME
NO.
CSSN
5
CSSP
6
DCINA
25
DCINP
2
DCINP
3
DCINP
4
EAI
11
EAO
10
FBO
12
ICOUT
23
ICREF
8
PGND
1
PGND
32
PGND
33
PGND
34
PHASE
28
PHASE
27
PHASE
29
PHASE
30
PHASE
31
Pin Functions (continued)
TYPE
DESCRIPTION
P
P
P
P
P
P
I
I
O
O
I
PGND
PGND
PGND
PGND
P
P
P
P
P
Adapter current sense resistor, negative input. An optional 0.1-uF ceramic capacitor is placed from CSSN pin
to AGND for common-mode filtering. A 0.1-uF ceramic capacitor is placed from CSSN to CSSP to provide
differential-mode filtering.
Adapter current sense resistor, positive input. A 0.1-uF ceramic capacitor is placed from CSSP pin to AGND
for common-mode filtering. A 0.1-uF ceramic capacitor is placed from CSSN to CSSP to provide differential-
mode filtering.
Analog sense of IC power positive supply for internal reference bias circuit. Connect directly to adapter input,
or to diode-OR point of adapter and battery. Place a 20Ω and 0.5uF ceramic capacitor filter from adapter to
AGND pin close to the IC and connect to DCINA on the node between the resistor and capacitor.
High current input for IC power positive supply, and connection to drain of high-side power MOSFET. Place
two 10uF ceramic capacitors from DCINP to PGND pin close to the IC.
High current input for IC power positive supply, and connection to drain of high-side power MOSFET. Place
two 10uF ceramic capacitors from DCINP to PGND pin close to the IC.
High current input for IC power positive supply, and connection to drain of high-side power MOSFET. Place
two 10uF ceramic capacitors from DCINP to PGND pin close to the IC.
Error Amplifier Input for compensation. Connect the feedback compensation components from EAI to EAO.
Connect the input compensation from FBO to EAI.
Error Amplifier Output for compensation. Connect the feedback compensation components from EAO to EAI.
Typically, a capacitor in parallel with a series resistor and capacitor. This node is internally compared to the
PWM saw-tooth oscillator signal.
Feedback Output for compensation. Connect the input compensation from FBO to EAI. Typically, a resistor in
parallel with a series resistor and capacitor.
Low power mode detect active-high open-drain logic output. Place a 10kohm pull-up resistor from ICOUT pin
to the pull-up voltage rail. Place a positive feedback resistor from ICOUT pin to ICREF pin for programming
hysteresis. The output is HI when VICM pin voltage is lower than ICREF pin voltage. The output is LO when
VICM pin voltage is higher than ICREF pin voltage.
Low power voltage set input. Connect a resistor divider from VREF to ICREF, and AGND to program the
reference for the LOPWR comparator. The ICREF pin voltage is compared to the VICM pin voltage and the
logic output is given on the ICOUT open-drain pin. Connecting a positive feedback resistor from ICREF pin to
ICOUT pin programs the hysteresis.
Power ground. Connection to source of integrated low-side power MOSFET. On PCB layout, connect to
ground connection of input and output capacitors of the charger. Only connect to AGND through the power-
pad underneath the IC.
Power ground. Connection to source of integrated low-side power MOSFET. On PCB layout, connect to
ground connection of in put and out put capacitors of the charger. Only connect to AGND through the power-
pad underneath the IC.
Power ground. Connection to source of integrated low-side power MOSFET. On PCB layout, connect to
ground connection of in put and out put capacitors of the charger. Only connect to AGND through the power-
pad underneath the IC
Power ground. Connection to source of integrated low-side power MOSFET. On PCB layout, connect to
ground connection of in put and out put capacitors of the charger. Only connect to AGND through the power-
pad underneath the IC.
Phase switching node (junction of the integrated high-side power MOSFET source and the integrated low-side
power MOSFET drain). Connect to the output inductor. Connect the 0.1uF bootstrap ceramic capacitor from
PHASE to BOOT
Phase switching node (junction of the integrated high-side power MOSFET source and the integrated low-side
power MOSFET drain). Connect to the output inductor. Connect the 0.1uF bootstrap ceramic capacitor from
PHASE to BOOT.
Phase switching node (junction of the integrated high-side power MOSFET source and the integrated low-side
power MOSFET drain). Connect to the output inductor. Connect the 0.1uF bootstrap ceramic capacitor from
PHASE to BOOT
Phase switching node (junction of the integrated high-side power MOSFET source and the integrated low-side
power MOSFET drain). Connect to the output inductor. Connect the 0.1uF bootstrap ceramic capacitor from
PHASE to BOOT.
Phase switching node (junction of the integrated high-side power MOSFET source and the integrated low-side
power MOSFET drain). Connect to the output inductor. Connect the 0.1uF bootstrap ceramic capacitor from
PHASE to BOOT.
4
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