BQ24070_14 Datasheet, PDF (4/33 Pages) Texas Instruments – System Power-Path Management IC

bq24070, bq24071
SLUS694G – MARCH 2006 – REVISED DECEMBER 2014
www.ti.com
NAME
VREF
PIN
NO.
1
VSS
11
Pin Functions (continued)
I/O
DESCRIPTION
O Internal reference signal
Ground input (the thermal pad on the underside of the package) There is an internal electrical connection
–
between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be
connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as
the primary ground input for the device. VSS pin must be connected to ground at all times.
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Input voltage IN (DC voltage with respect to VSS)
–0.3
18
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1, STAT2, TS, (all DC
voltages with respect to VSS)
–0.3
7
V
Input voltage _{VREF (DC voltage with respect to VSS)}
–0.3
V_O(OUT) +
0.3
Input current
TMR
–0.3
V_O + 0.3
3.5
OUT
Output current _BAT(2)
4
A
–4
3.5
Output source
current (in
regulation at
3.3-V V_REF)
Output sink
current
V_REF
PG, STAT1, STAT2,
30
mA
15
mA
Junction temperature, T_J
Lead temperature (soldering, 10 s)
–40
150
300
°C
Storage temperature, T_stg
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±1000
±250
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
7.3 Recommended Operating Conditions
V_CC Supply voltage (V_IN) ⁽¹⁾
I_IN Input current
T_J Operating junction temperature range
(1) Verify that power dissipation and junction temperatures are within limits at maximum V_CC .
MIN
MAX UNIT
4.35
16 V
2A
–40
125 °C
4
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