TLC34077 Datasheet, PDF (39/41 Pages) Texas Instruments – Video Interface Palette Data Manual

Appendix C
Mechanical Data
FN020, FN028, FN044, FN052, FN068, and FN084
plastic J-leaded chip carrier
Each of these chip carrier packages consists of a circuit mounted on a lead frame and enncapsulated
within an electrically nonconductive plastic compound. The compound withstands soldering
temperatures with no deformation, and circuit performance characteristics remain stable when the
devices are operated in high-humidity conditions. The package is intended for surface mounting on
1,27 (0.050) centers. Leads require no additional cleaning or processing when used in soldered
assembly.
FN020, FN028, FN044, FN052, FN068, and FN084
(20-PIN package used for illustration)
D
0.18 (0.007) S B S D–E S
– A – _{D1 (see Note B)}
0.18 (0.007) S B S D–E S
(0.002 IN./IN.) B
1,22 (0.048) _{2 Places}
1,07 (0.042)
–D–
(see Note C)
4 ^{3 2 1 20 19} 18
5
17
6
16
7
15
8
14
9 10 11 12 13
Designation per JEDEC Std 30:
S-PLCC-J20
S-PLCC-J28
S-PLCC-J44
S-PLCC-J52
S-PLCC-J68
S-PLCC-J84
0,51 (0.020) R. MAX
3 Places
1,42 (0.056)
1,07 (0.042)
0,81 (0.032)
0,66 (0.026)
TYP
0.18 (0.007) S B S A S
2 Sides (see Note E)
1,27 (0.050) T.P.
4 Sides
–G–
(see Note C)
–H– ^{(see Note D)}
A1
Seating Plane
(see Note B)
–C–
A
0.10 (0.004)
1,14 (0.045)
0,64 (0.025)
R. TYP
D3, E3
D2, E2
(see Note F)
(see Note F)
0.38 (0.015) S D–E S
0.38 (0.015) S F–G S
–E–
(see Note C)
0,36 (0.014)
0,20 (0.008)
0,51 (0.020) MIN
(Includes Lead Finish)
Sum of Dam Bar Protrusions
to be 0,18 (0.007) Maximum
Per Lead
1,52 (0.060) MIN
–C–
0,53 (0.021)
0,33 (0.013)
0.18 (0.007) M F–G S
0.18 (0.007) M D–E S
(see table on following page for additional dimensions)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
0,64 (0.025)
MIN
C-1