TMS320DM6467T_17 Datasheet, PDF (348/352 Pages) Texas Instruments – Digital Media System-on-Chip

TMS320DM6467T
SPRS605C – JULY 2009 – REVISED JUNE 2012
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8 Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance characteristics for the PBGA–CUT mechanical
package.
8.1 Thermal Data for CUT
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [CUT]
NO.
1
RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
°C/W ⁽¹⁾
1.5
9.9
19.2
14.8
13.8
12.7
11.9
0.3
0.4
0.4
0.4
0.5
9.0
8.0
7.7
7.3
7.0
AIR FLOW (m/s)⁽²⁾
N/A
N/A
0.00
0.50
1.00
2.00
3.00
0.00
0.50
1.00
2.00
3.00
0.00
0.50
1.00
2.00
3.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
(2) m/s = meters per second
8.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
348 Mechanical Packaging and Orderable Information
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