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BQ24735_17 Datasheet, PDF (30/46 Pages) Texas Instruments – 1- to 4-Cell Li+ Battery SMBus Charge Controller for Supporting Turbo Boost Mode With N-Channel Power MOSFET Selector
bq24735
SLUSAK9B – SEPTEMBER 2011 – REVISED APRIL 2015
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Ceramic capacitors show a DC-bias effect. This effect reduces the effective capacitance when a DC-bias voltage
is applied across a ceramic capacitor, as on the output capacitor of a charger. The effect may lead to a
significant capacitance drop, especially for high output voltages and small capacitor packages. See the
manufacturer's data sheet about the performance with a DC-bias voltage applied. It may be necessary to choose
a higher voltage rating or nominal capacitance value in order to get the required value at the operating point.
10.2.2.7 Power MOSFETs Selection
Two external N-channel MOSFETs are used for a synchronous switching battery charger. The gate drivers are
internally integrated into the IC with 6 V of gate drive voltage. A 30-V or higher voltage rating MOSFETs are
preferred for 19- to 20-V input voltage.
Figure-of-merit (FOM) is usually used for selecting proper MOSFET based on a tradeoff between the conduction
loss and switching loss. For the top-side MOSFET, FOM is defined as the product of a MOSFET ON-resistance,
RDS(ON), and the gate-to-drain charge, QGD. For the bottom-side MOSFET, FOM is defined as the product of the
MOSFET ON-resistance, RDS(ON), and the total gate charge, QG.
FOMtop = RDS(on) x QGD; FOMbottom = RDS(on) x QG
(8)
The lower the FOM value, the lower the total power loss. Usually lower RDS(ON) has higher cost with the same
package size.
The top-side MOSFET loss includes conduction loss and switching loss. It is a function of duty cycle
(D=VOUT/VIN), charging current (ICHG), MOSFET ON-resistance (RDS(ON)), input voltage (VIN), switching frequency
(fS), turnon time (ton) and turnoff time (toff):
Ptop = D ´ ICHG2
´ RDS(on) +
1
2
´ VIN
´ ICHG
´ (ton + toff ) ´ fs
(9)
The first item represents the conduction loss. Usually MOSFET RDS(ON) increases by 50% with 100°C junction
temperature rise. The second term represents the switching loss. The MOSFET turnon and turnoff times are
given by:
ton
=
QSW ,
Ion
toff
=
QSW
Ioff
(10)
where Qsw is the switching charge, Ion is the turnon gate driving current and Ioff is the turnoff gate driving current.
If the switching charge is not given in MOSFET data sheet, it can be estimated by gate-to-drain charge (QGD)
and gate-to-source charge (QGS):
1
QSW = QGD + 2 ´ QGS
(11)
Gate driving current can be estimated by REGN voltage (VREGN), MOSFET plateau voltage (Vplt), total turnon
gate resistance (Ron) and turnoff gate resistance (Roff) of the gate driver:
Ion
=
VREGN - Vplt ,
Ron
Ioff
=
Vplt
Roff
(12)
The conduction loss of the bottom-side MOSFET is calculated with the following equation when it operates in
synchronous continuous conduction mode:
Pbottom = (1 - D) x ICHG 2 x RDS(on)
(13)
When charger operates in nonsynchronous mode, the bottom-side MOSFET is off. As a result all the
freewheeling current goes through the body-diode of the bottom-side MOSFET. The body diode power loss
depends on its forward voltage drop (VF), nonsynchronous mode charging current (INONSYNC), and duty cycle (D).
PD = VF x INONSYNC x (1 - D)
(14)
The maximum charging current in nonsynchronous mode can be up to 0.25 A for a 10-mΩ charging current
sensing resistor, or 0.5 A if battery voltage is below 2.5 V. The minimum duty cycle happens at lowest battery
voltage. Choose the bottom-side MOSFET with either an internal Schottky or body diode capable of carrying the
maximum nonsynchronous mode charging current.
30
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