OMAP3515DCUS Datasheet, PDF (3/264 Pages) Texas Instruments – OMAP3515 and OMAP3503 Applications Processors

OMAP3515, OMAP3503
www.ti.com
SPRS505H – FEBRUARY 2008 – REVISED OCTOBER 2013
1.3 Description
OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing
sufficient to support the following:
• Streaming video
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
• Linux®
• Windows® CE
• Android™
This OMAP device includes state-of-the-art power-management techniques required for high-performance
mobile products.
The following subsystems are part of the device:
• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected
to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a
programmable interface supporting a wide variety of displays. The display subsystem also supports
NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple
initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
• A comprehensive power- and clock-management scheme that enables high-performance, low-power
operation, and ultralow-power standby features. The device also supports SmartReflex adaptative
voltage control. This power-management technique for automatic control of the operating voltage of a
module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC
packages only)
OMAP3515 and OMAP3503 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-
PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and
CBC packages are not available in the CUS package. (See Table 1-1 for package differences).
This data manual presents the electrical and mechanical specifications for the OMAP3515 and
OMAP3503 applications processors. The information in this data manual applies to both the commercial
and extended temperature versions of the OMAP3515 and OMAP3503 applications processors unless
otherwise indicated. This data manual consists of the following sections:
• Section 2, Terminal Description: assignment, electrical characteristics, multiplexing, and functional
description
• Section 3, Electrical Characteristics: power domains, operating conditions, power consumption, and
DC characteristics
• Section 4, Clock Specifications: input and output clocks, DPLL and DLL
• Section 5, Video DAC Specifications
• Section 6, Timing Requirements and Switching Characteristics
• Section 7, Package Characteristics: thermal characteristics, device nomenclature, and mechanical data
for available packaging
Copyright © 2008–2013, Texas Instruments Incorporated
OMAP3515 and OMAP3503 Applications Processors
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