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BQ24030-Q1 Datasheet, PDF (3/34 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC
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bq24030-Q1
bq24031-Q1
www.ti.com.................................................................................................................................................... SLUS793B – APRIL 2008 – REVISED OCTOBER 2009
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
AC (dc voltage with respect to VSS)
USB (dc voltage with respect to VSS)
Input voltage
BAT, CE, DPPM, ACPG, PSEL, OUT, ISET1, ISET2, STAT1,
STAT2, TS, USBPG (all dc voltages with respect to VSS)
LDO (dc voltage with respect to VSS)
TMR
Input current
AC
USB
Output current
OUT
BAT (2)
Output source current
(in regulation at 3.3-V LDO)
LDO
Output sink current
ACPG, STAT1, STAT2, USBPG
Storage temperature range, Tstg
Operating virtual-junction temperature range, TJ
Lead temperature (soldering, 10 seconds)
–0.3 V to 18 V
–0.3 V to 7 V
–0.3 V to 7 V
–0.3 V to (VO(OUT) + 0.3 V)
–0.3 V to (VO(LDO) + 0.3 V)
3.5 A
1000 mA
4A
–4 A to 3.5 A
30 mA
15 mA
–65°C to 150°C
–40°C to 125°C
300°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
VCC Supply voltage
From AC input(1) (2)
From USB input(1)
IAC
Input current, AC
IUSB Input current, USB
TA
Operating ambient temperature
(1) VCC is defined as the greater of AC or USB input.
(2) Verify that power dissipation and junction temperatures are within limits at maximum VCC.
MIN MAX UNIT
4.35
16 V
4.35
6V
2
A
0.5
–40
85 °C
DISSIPATION RATINGS
PACKAGE
20-pin RHL(1)
TA ≤ 40°C
POWER RATING
1.81 W
DERATING FACTOR
TA > 40°C
21 mW/°C
θJA
46.87 °C/W
(1) This data is based on using the JEDEC High-K board, and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
Copyright © 2008–2009, Texas Instruments Incorporated
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