BQ24030-Q1 Datasheet, PDF (26/34 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC

bq24030-Q1
bq24031-Q1
SLUS793B – APRIL 2008 – REVISED OCTOBER 2009.................................................................................................................................................... www.ti.com
PCB Layout Considerations
It is important to pay special attention to the PCB layout. The following provides some guidelines:
• To obtain optimal performance, the decoupling capacitor from input terminals to VSS and the output filter
capacitors from OUT to VSS should be placed as close as possible to the bqTINY III series, with short trace
runs to both signal and VSS pins.
• All low-current VSS connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
• The high-current charge paths into AC and USB and from the BAT and OUT pins must be sized appropriately
for the maximum charge current in order to avoid voltage drops in these traces.
• The bqTINY III series is packaged in a thermally enhanced MLP package. The package includes a QFN
thermal pad to provide an effective thermal contact between the device and the printed-circuit board. Full
PCB design guidelines for this package are provided in the application report QFN/SON PCB Attachment
(SLUA271).
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