OMAP-L138_16 Datasheet, PDF (280/286 Pages) Texas Instruments – OMAP-L138 C6000 DSP ARM Processor

OMAP-L138
SPRS586I – JUNE 2009 – REVISED SEPTEMBER 2014
www.ti.com
8.2 Thermal Data for ZWT Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
1
RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
°C/W ⁽¹⁾
7.3
12.4
23.7
21.0
20.1
19.3
18.4
0.2
0.3
0.3
0.4
0.5
12.3
12.2
12.1
12.0
11.9
AIR FLOW (m/s)⁽²⁾
N/A
N /A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) m/s = meters per second
8.3 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
280 Mechanical Packaging and Orderable Information
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