MSP430F5172_16 Datasheet, PDF (28/117 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430F5172, MSP430F5152, MSP430F5132
MSP430F5171, MSP430F5151, MSP430F5131
SLAS619P – AUGUST 2010 – REVISED MAY 2016
www.ti.com
5.22 Crystal Oscillator, XT1, High-Frequency Mode⁽¹⁾
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V_CC
f_OSC = 4 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
T_A = 25°C
f_OSC = 12 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
I_DVCC,HF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, HF mode
T_A = 25°C
f_OSC = 20 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
3V
T_A = 25°C
f_OSC = 32 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
T_A = 25°C
f_XT1,HF0
XT1 oscillator crystal frequency,
HF mode 0
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0⁽²⁾
MIN TYP
200
260
325
450
4
f_XT1,HF1
XT1 oscillator crystal frequency,
HF mode 1
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1⁽²⁾
8
f_XT1,HF2
XT1 oscillator crystal frequency,
HF mode 2
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2⁽²⁾
16
f_XT1,HF3
XT1 oscillator crystal frequency,
HF mode 3
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3⁽²⁾
24
f_XT1,HF,SW
XT1 oscillator logic-level square-
wave input frequency, HF mode
XTS = 1,
XT1BYPASS = 1^{(3) (2)}
0.7
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0,
450
f_XT1,HF = 6 MHz, C_L,eff = 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1,
320
OA_HF
Oscillation allowance for
HF crystals⁽⁴⁾
f_XT1,HF = 12 MHz, C_L,eff = 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2,
200
f_XT1,HF = 20 MHz, C_L,eff = 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3,
200
f_XT1,HF = 32 MHz, C_L,eff = 15 pF
f_OSC = 6 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0,
0.5
t_START,HF Start-up time, HF mode
T_A = 25°C, C_L,eff = 15 pF
f_OSC = 20 MHz, XTS = 1,
3V
XT1BYPASS = 0, XT1DRIVEx = 2,
0.3
T_A = 25°C, C_L,eff = 15 pF
C_L,eff
Integrated effective load
capacitance, HF mode^{(5) (6)}
XTS = 1
1
MAX UNIT
µA
8 MHz
16 MHz
24 MHz
32 MHz
32 MHz
Ω
ms
pF
(1) To improve EMI on the XT1 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) Maximum frequency of operation of the entire device cannot be exceeded.
(3) When XT1BYPASS is set, the VLO, REFO, XT1 circuits are automatically powered down.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
28
Specifications
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