AM1806_16 Datasheet, PDF (239/245 Pages) Texas Instruments – AM1806 ARM® Microprocessor

www.ti.com
AM1806
SPRS658F – FEBRUARY 2010 – REVISED MARCH 2014
8.2 Thermal Data for ZWT Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W ⁽¹⁾
AIR FLOW (m/s)⁽²⁾
1
RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
Junction-to-case
Junction-to-board
Junction-to-free air
7.3
N/A
12.4
N /A
23.7
0.00
21.0
0.50
5
6
RΘ_JMA
Junction-to-moving air
20.1
1.00
19.3
2.00
7
18.4
4.00
8
0.2
0.00
9
0.3
0.50
10 Psi_JT
11
Junction-to-package top
0.3
1.00
0.4
2.00
12
0.5
4.00
13
12.3
0.00
14
12.2
0.50
15 Psi_JB
16
Junction-to-board
12.1
1.00
12.0
2.00
17
11.9
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) m/s = meters per second
Copyright © 2010–2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information 239
Submit Documentation Feedback
Product Folder Links: AM1806