MSP430F249-EP_14 Datasheet, PDF (23/82 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430F249-EP
MIXED SIGNAL MICROCONTROLLER
2008
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Voltage applied at V_CC to V_SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V
Voltage applied to any pin^‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V_CC + 0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature^§, T_stg:Unprogrammed device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Programmed device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ _{All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to}
the TDI/TCLK pin when blowing the JTAG fuse.
§ _{Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak reflow}
temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
PARAMETER
Supply voltage during program execution, V_CC
Supply voltage during flash memory programming, V_CC
Supply voltage, V_SS
Operating free-air temperature range, T_A
Flash temperature range
AV_CC = DV_CC = V_CC (see Note 1)
AV_CC = DV_CC = V_CC (see Note 1)
AV_SS = DV_SS = V_SS
Read
Write
V_CC = 1.8 V,
Duty cycle = 50% ± 10%
MIN
MAX UNITS
1.8
3.6 V
2.2
3.6 V
0.0
0.0 V
−55
125 °C
−55
125 °C
−55
125 °C
dc
4.15
Processor frequency f_SYSYTEM (maximum MCLK frequency)
(see Notes 2 and 3 and Figure 1)
V_CC = 2.7 V,
Duty cycle = 50% ± 10%
dc
12 MHz
V_CC ≥ 3.3 V,
Duty cycle = 50% ± 10%
dc
16
NOTES:
1. It is recommended to power AV_CC and DV_CC from the same source. A maximum difference of 0.3 V between AV_CC and DV_CC can
be tolerated during power-up.
2. The MSP430 CPU is clocked directly with MCLK.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
3. Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
16 MHz
12 MHz
7.5 MHz
4.15 MHz
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ ÏÏÏÏÏÏÏÏÏÏÏÏ ^Legend:
Supply voltage range
during flash memory
programming
Supply voltage range
during program execution
1.8 V 2.2 V
2.7 V
3.3 V 3.6 V
Supply Voltage −V
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V_CC of 2.2 V.
Figure 1. Operating Area
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