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TLK1201ARCP_16 Datasheet, PDF (17/24 Pages) Texas Instruments – Single Monolithic PLL Design
PACKAGE OPTION ADDENDUM
www.ti.com
11-Aug-2016
PACKAGING INFORMATION
Orderable Device
TLK1201AIRCP
TLK1201AIRCPG4
TLK1201AIRCPR
TLK1201AIRCPRG4
TLK1201ARCP
TLK1201ARCPG4
TLK1201ARCPR
TLK1201ARCPRG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
LIFEBUY HVQFP
RCP 64 160 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 160 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 1000 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 1000 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 160 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 160 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 1000 Green (RoHS
& no Sb/Br)
LIFEBUY HVQFP
RCP 64 1000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
Level-3-260C-168 HR 0 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TLK1201AI
TLK1201AI
TLK1201AI
TLK1201AI
TLK1201A
TLK1201A
TLK1201A
TLK1201A
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Samples
Addendum-Page 1