TLK1201ARCP_16 Datasheet, PDF (15/24 Pages) Texas Instruments – Single Monolithic PLL Design

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Host
Protocol
Device
JTAG
Controller
TLK1201ARCP, TLK1201AIRCP
ETHERNET TRANSCEIVERS
SLLS580D – FEBRUARY 2004 – REVISED SEPTEMBER 2007
2.5 V
5 Ω at 100 MHz
2.5 V
VDD VDDA
18
VDDPLL
0.01 µF
GND
GNDPLL ⁶⁴
GNDA
TLK1201AI
TLK1201AII
17
TESTEN
10
TD0-TD9
TXP ⁶²
22
REFCLK
16
PRBSEN
19
LOOPEN
24
SYNCEN
TXN ⁶¹
47
SYNC/PASS
10
RD0-RD9
2
RBC0-RBC1
28
ENABLE
RXP ⁵⁴
26 _LOS
32
RBCMODE
15
MODESEL
49
TCK
55
JTMS
48
JTDI
56
JTRSTN
R_t 50 Ω
R_t
RXN ⁵²
50 Ω
27 _JTDO
Controlled Impedance
Transmission Line
Controlled Impedance
Transmission Line
Controlled Impedance
Transmission Line
Controlled Impedance
Transmission Line
Figure 12. Typical Application Circuit (AC Mode)
DESIGNING WITH PowerPAD™
The TLK1201A/TLK1201AI is housed in a high-performance, thermally enhanced, 64-pin VQFP (RCP64)
PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note
that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches
or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal land. The
recommended convention, however, is to not run any etches or signal vias under the device, but to have only a
grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the
minimum size required for the keepout area for the 64-pin PFP PowerPAD package is 8 mm × 8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
Copyright © 2004–2007, Texas Instruments Incorporated
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