TLK1201ARCP_16 Datasheet, PDF (10/24 Pages) Texas Instruments – Single Monolithic PLL Design

TLK1201ARCP, TLK1201AIRCP
ETHERNET TRANSCEIVERS
SLLS580D – FEBRUARY 2004 – REVISED SEPTEMBER 2007
www.ti.com
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V_DD (see ⁽²⁾)
Input voltage range at TTL terminals, V_I
Input voltage range at any other terminal
Storage temperature, T_stg
Electrostatic discharge
Characterized free-air operating temperature range
TLK1201A
TLK1201AI
TLK1201A/TLK1201AI
–0.3 V to 3 V
–0.5 V to 4 V
–0.3 V to V_DD +0.3 V
–65°C to 150°C
CDM: 1 kV, HBM:2 kV
0°C to 70°C
–40°C to 85°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
PACKAGE
RCP64 ⁽²⁾
RCP64 ⁽³⁾
RCP64 ⁽⁴⁾
T_A ≤ 25°C
POWER RATING
5.25 W
3.17 W
2.01 W
OPERATING FACTOR⁽¹⁾
ABOVE T_A = 25°C
46.58 mW/°C
23.70 mW/°C
13.19 mW/°C
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (R_ΘJA).
(2) 2 oz. Trace and copper pad with solder
(3) 2 oz. Trace and copper pad without solder
(4) Standard JEDEC high-K board
T_A = 70°C
POWER RATING
2.89 W
1.74 W
1.11 W
PARAMETER
R_ΘJA
Junction-to-free-air thermal
resistance
R_ΘJC
Junction-to-case-thermal
resistance
Thermal Characteristics
TEST CONDITION
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no solder or
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no solder or
grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
MIN TYP MAX UNIT
21.47
°C/W
42.2
75.83
0.38
°C/W
0.38
7.8
10
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