TMS320TCI6482GTZ Datasheet, PDF (160/260 Pages) Texas Instruments – Communications Infrastructure Digital Signal Processor

TMS320TCI6482
SPRS246K – APRIL 2005 – REVISED MARCH 2012
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8.9 DDR2 Memory Controller
The 32-bit, 533-MHz (data rate) DDR2 Memory Controller bus of the TCI6482 device is used to interface
to JESD79-2A standard-compliant DDR2 SDRAM devices. The DDR2 external bus only interfaces to
DDR2 SDRAM devices (up to 512 MB); it does not share the bus with any other types of peripherals. The
decoupling of DDR2 memories from other devices both simplifies board design and provides I/O
concurrency from a second external memory interface, EMIFA.
The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum
throughput of the DDR2 bus. The clock frequency of the DDR2 bus is equal to the CLKIN2 frequency
multiplied by 10. The internal data bus clock frequency of the DDR2 Memory Controller is fixed at a divide-
by-three ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller of the
two bus frequencies. For example, if the internal data bus frequency is 333 MHz (CPU frequency is 1
GHz) and the DDR2 bus frequency is 267 MHz (CLKIN2 frequency is 26.7 MHz), the maximum data rate
achievable by the DDR2 memory controller is 2.1 Gbytes/sec. The DDR2 bus is designed to sustain a
maximum throughput of up to 2.1 Gbytes/sec at a 533-MHz data rate (267-MHz clock rate), as long as
data requests are pending in the DDR2 Memory Controller.
8.9.1 DDR2 Memory Controller Device-Specific Information
The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces
such as EMIF, HPI, and McBSP. For these other interfaces the device timing was specified in terms of
data manual specifications and I/O buffer information specification (IBIS) models.
For the TCI6482 DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the
printed circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has
performed the simulation and system characterization to ensure all DDR2 interface timings in this solution
are met. The complete DDR2 system solution is documented in the Implementing DDR2 PCB Layout on
the TMS320TCI6482 application report (literature number SPRAAA9) .
TI only supports designs that follow the board design guidelines outlined in the SPRAAA9
application report.
The DDR2 Memory Controller pins must be enabled by setting the DDR2_EN configuration pin (ABA0)
high during device reset. For more details, see Section 3.1, Device Configuration at Device Reset.
The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2
memory device(s) must be connected to ground.
The DDR2 memory controller on the TCI6482 device supports the following memory topologies:
• A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.
• A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.
A race condition may exist when certain masters write data to the DDR2 memory controller. For example,
if master A passes a software message via a buffer in external memory and does not wait for indication
that the write completes, when master B attempts to read the software message, then the master B read
may bypass the master A write and, thus, master B may read stale data and, therefore, receive an
incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the DDR2 memory controller module ID and revision register.
3. Perform a dummy read to the DDR2 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
160 C64x+ Peripheral Information and Electrical Specifications
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