TLK1211 Datasheet, PDF (16/21 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK1211RCP
SLLS658D – SEPTEMBER 2006 – REVISED APRIL 2011
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Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web pages
beginning at URL: http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK1211RCP, this thermal land must be grounded to the low-impedance ground plane of the device.
This improves not only thermal performance but also the electrical grounding of the device. It is also
recommended that the device ground terminal landing pads be connected directly to the grounded thermal land.
The land size must be as large as possible without shorting device signal terminals. The thermal land may be
soldered to the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
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