ADC32RF80_16 Datasheet, PDF (134/136 Pages) Texas Instruments – Dual-Channel, 3-GSPS Telecom Receiver and Feedback Devices

RMP0072A
72X (0.6)
72
1
72X (0.24)
( 8.5)
SYMM
EXAMPLE BOARD LAYOUT
VQFN - 0.9 mm max height
VQFN
SEE DETAILS
55
54
(0.25) TYP
SYMM
68X (0.5)
(9.8)
(1.315) TYP
( 0.2) TYP
VIA
18
19
37
(9.8)
36
(1.315) TYP
LAND PATTERN EXAMPLE
SCALE:8X
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221047/B 02/2014
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com