ADC32RF44 Datasheet, PDF (131/134 Pages) Texas Instruments – Dual-Channel, 14-Bit, 2.6-GSPS, Analog-to-Digital Converter

RMP0072A
B
PIN 1 ID
SCALE 1.700
10.1
9.9
PACKAGE OUTLINE
VQFN - 0.9 mm max height
VQFN
A
10.1
9.9
0.9 MAX
(0.2)
4X (45 X0.42)
19
18
0.05
0.00
C
0.08 C
SEATING PLANE
36
37
4X ^SYMM
8.5
8.5 0.1
PIN 1 ID
(R0.2)
68X 0.5
1
72
NOTES:
SYMM
54
55
72X
0.5
0.3
72X
0.30
0.18
0.1 C B
0.05 C
A
4221047/B 02/2014
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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