CC2400 Datasheet, PDF (77/84 Pages) Texas Instruments – 2.4 GHz Low-Power RF Transceiver

51 Recommended layout for package (QFN48)
CC2400
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via
holes distributed symmetrically in the ground pad under the package. See also the
CC2400EM reference design.
52 Package Thermal Properties
Thermal resistance
Air velocity [m/s] 0
Rth,j-a [K/W]
25.6
53 Soldering Information
Recommended soldering profile for both standard leaded packages and Pb-free packages is
according to IPC/JEDEC J-STD-020B, July 2002.
SWRS042A
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