CC2400 Datasheet, PDF (56/84 Pages) Texas Instruments – 2.4 GHz Low-Power RF Transceiver

CC2400
47 PCB Layout Recommendations
A four layer PCB is highly recommended.
The second layer of the PCB should be
the “ground-layer”.
The top layer should be used for signal
routing, and the open areas should be
filled with metallization connected to
ground using several vias.
The area under the chip is used for
grounding and must be connected closely
to the ground plane with several vias.
The ground pins should be connected to
ground as close as possible to the
package pin using individual vias. The de-
coupling capacitors should also be placed
as close as possible to the supply pins
and connected to the ground plane by
separate vias. Supply power filtering is
very important.
The external components should be as
small as possible (0402 is recommended)
and surface mount devices must be used.
Please note that components smaller than
those specified may have differing
characteristics.
Caution should be used when placing the
microcontroller in order to avoid
interference with the RF circuitry.
A Development Kit with a fully assembled
Evaluation Module is available. It is
strongly advised that this reference layout
is followed very closely in order to achieve
the best performance.
The schematic, BOM and layout Gerber
files for the reference designs are all
available from the Chipcon website.
SWRS042A
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