BQ24171_15 Datasheet, PDF (6/39 Pages) Texas Instruments – bq24171 JEITA-Compliant Stand-Alone, Switched-Mode Li-Ion and Li-Polymer Battery Charger With Integrated MOSFETs and Power Path Selector

bq24171
SLUSAF2C – FEBRUARY 2011 – REVISED APRIL 2015
8 Specifications
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8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
Voltage (with respect to
AGND)
Maximum difference voltage
Junction temperature, T_J
Storage temperature, T_stg
AVCC, ACP, ACN, ACDRV, CMSRC, STAT
PVCC
BATDRV, SRP, SRN
SW
FB
OVPSET, REGN, TS, TTC
VREF, ISET, ACSET
PGND
SRP–SRN, ACP-ACN
MIN
MAX
UNIT
–0.3
30
–0.3
20
–0.3
20
–2
20
V
–0.3
16
–0.3
7
–0.3
3.6
–0.3
0.3
–0.5
0.5
V
–40
155
°C
–55
155
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
8.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
1000
250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
8.3 Recommended Operating Conditions
Input voltage
Output voltage
Output current (R_SR 10 mΩ)
Maximum difference voltage
V_IN
V_OUT
I_OUT
ACP - ACN
SRP–SRN
Operation free-air temperature, T_A
MIN
4.5
0.6
–200
–200
–40
MAX
17
13.5
4
200
200
85
UNIT
V
V
A
mV
°C
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq24171
RGY [VQFN]
UNIT
24 PINS
R_θJA
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
35.7
0.4
°C/W
31.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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