DRV8711 Datasheet, PDF (5/34 Pages) Texas Instruments – STEPPER MOTOR CONTROLLER IC

DRV8711
www.ti.com
SLVSC40 – JUNE 2013
ABSOLUTE MAXIMUM RATINGS^{(1) (2) (3)}
over operating free-air temperature range (unless otherwise noted)
DRV8711
UNIT
Power supply voltage range
-0.6 to 60
V
Charge pump voltage range (CP1, CP2, VCP)
-0.6 to VM + 12
V
5V regulator voltage (V5)
-0.6 to 5.5
V
Internal regulator voltage (VINT)
-0.6 to 2.0
V
Digital pin voltage range (SLEEPn, RESET, STEP/AIN1, DIR/AIN2, BIN1, BIN2, SCS, SCLK, SDATI,
SDATO, FAULTn, STALLn/BEMFVn)
-0.6 to 5.5
V
High-side gate drive pin voltage range (A1HS, A2HS, B1HS, B2HS)
-0.6 to VM + 12
V
Low-side gate drive pin voltage range (A1LS, A2LS, B1LS, B2LS)
-0.6 to 12
V
Phase node pin voltage range (AOUT1, AOUT2, BOUT1, BOUT2)
-0.6 to VM
V
ISENSEx pin voltage (AISENP, AISENN, BISENP, BISENN)
-0.7 to +0.7
V
BEMF pin voltage range (BEMF)
-0.6 to VM
V
Operating virtual junction temperature range, T_J
Storage temperature range, T_stg
-40 to 150
°C
-60 to 150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
DRV8711
DCP
UNITS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case (top) thermal resistance⁽³⁾
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-top characterization parameter⁽⁵⁾
Junction-to-board characterization parameter⁽⁶⁾
Junction-to-case (bottom) thermal resistance⁽⁷⁾
38 PINS
32.7
17.2
14.3
0.5
14.1
0.9
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V_M
Motor power supply voltage range
I_VS
V5 external load current
T_A
Operating ambient temperature range
MIN NOM MAX UNIT
8
52
V
0
10 mA
-40
85
°C
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