BQ24158_12 Datasheet, PDF (40/45 Pages) Texas Instruments – Fully Integrated Switch-Mode One-Cell Li-Ion Charger

PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2012
PACKAGING INFORMATION
Orderable Device
BQ24153AYFFR
BQ24153AYFFT
BQ24156AYFFR
BQ24156AYFFT
BQ24158YFFR
BQ24158YFFT
BQ24159YFFR
BQ24159YFFT
Status ^{(1) Package Type Package}
Drawing
ACTIVE
DSBGA
YFF
Pins
20
Package Qty
3000
ACTIVE
DSBGA
YFF
20
250
ACTIVE
DSBGA
YFF
20
3000
ACTIVE
DSBGA
YFF
20
250
ACTIVE
DSBGA
YFF
20
3000
ACTIVE
DSBGA
YFF
20
250
ACTIVE
DSBGA
YFF
20
3000
ACTIVE
DSBGA
YFF
20
250
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 1