AM1707_15 Datasheet, PDF (37/200 Pages) Texas Instruments – AM1707 ARM® Microprocessor

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AM1707
SPRS637E – FEBRUARY 2010 – REVISED JUNE 2014
5 Device Operating Conditions
5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range
(Unless Otherwise Noted) ⁽¹⁾
Supply voltage ranges
Input voltage ranges
Core
(CVDD, RVDD, RTC_CVDD, PLL0_VDDA ) ⁽²⁾
I/O, 1.8V
(USB0_VDDA18, USB1_VDDA18) ⁽²⁾
I/O, 3.3V
(DVDD, USB0_VDDA33, USB1_VDDA33) ⁽²⁾
V_I I/O, 1.2V
(OSCIN, RTC_XI)
V_I I/O, 3.3V
(Steady State)
V_I I/O, 3.3V
(Transient)
V_I I/O, USB 5V Tolerant Pins:
(USB0_DM, USB0_DP, USB0_ID, USB1_DM, USB1_DP)
Output voltage ranges
V_I I/O, USB0 VBUS
V_O I/O, 3.3V
(Steady State)
V_O I/O, 3.3V
(Transient Overshoot/Undershoot)
Clamp Current
Input or Output Voltages 0.3V above or below their respective power
rails. Limit clamp current that flows through the I/O's internal diode
protection cells.
Operating Junction Temperature ranges,
T_J
Commercial (default)
Industrial (D version)
Extended (A version)
Automotive (T version)
-0.5 V to 1.4 V
-0.5 V to 2 V
-0.5 V to 3.8V
-0.3 V to CVDD + 0.3V
-0.3V to DVDD + 0.35V
DVDD + 20%
up to 20% of Signal
Period
5.25V ⁽³⁾
5.50V ⁽³⁾
-0.5 V to DVDD + 0.3V
20% of DVDD for up to
20% of the signal period
±20mA
0°C to 90°C
-40°C to 90°C
-40°C to 105°C
-40°C to 125°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, PLL0_VSSA, OSCVSS, RTC_VSS
(3) Up to a max of 24 hours.
5.2 Handling Ratings
Storage temperature
range, T_stg
ESD Stress Voltage,
V_ESD ⁽¹⁾
(default)
Human Body Model (HBM)⁽²⁾
Charged Device Model (CDM)⁽³⁾
-55 to 150
>2000
>500
UNIT
°C
V
V
(1) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500V HBM allows
safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary
precautions are taken. Pins listed as 1000V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250V CDM allows safe
manufacturing with a standard ESD control process. Pins listed as 250V may actually have higher performance.
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Device Operating Conditions
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