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| MSP430FG47X Datasheet, PDF (24/91 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER | |||
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MSP430FG47x
MIXED SIGNAL MICROCONTROLLER
SLAS580D -- OCTOBER 2008 -- REVISED MARCH 2011
absolute maximum ratings over operating free-air temperature (see Note 1)
Voltage applied at VCC to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 4.1 V
Voltage applied to any pin (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to VCC + 0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ï±2 mA
Storage temperature, Tstg: (unprogrammed device, see Note 3) . . . . . . . . . . . . . . . . . . . . . . . --55ï°C to 150ï°C
(programmed device, see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . --40ï°C to 85ï°C
NOTES: 1. Stresses beyond those listed under âabsolute maximum ratingsâ may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ârecommended
operating conditionsâ is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
2. All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage
is applied to the TDI/TCLK pin when blowing the JTAG fuse.
3. Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
MIN NOM
MAX UNITS
Supply voltage during program execution,
VCC (AVCC = DVCC = VCC)
Supply voltage during flash memory programming,
VCC (AVCC = DVCC = VCC)
Supply voltage, VSS (AVSS = DVSS = VSS)
Operating free-air temperature range, TA
LF selected,
XTS_FLL = 0
Watch crystal
1.8
2.2
0
--40
32.768
3.6
V
3.6
V
0
V
85 ï°C
kHz
LFXT1 crystal frequency, f(LFXT1)
(see Note 1)
XT1 selected,
XTS_FLL = 1
Ceramic resonator
0.45
6 MHz
XT1 selected,
XTS_FLL = 1
Crystal
1
6 MHz
XT2 crystal frequency, f(XT2)
Ceramic resonator
0.45
Crystal
1
8
8 MHz
System frequency, MCLK, ACLK, SMCLK , f(System)
VCC = 1.8 V
dc
VCC = 2.5 V
dc
4.15
8 MHz
NOTES: 1. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
fSystem (MHz)
8 MHz
Supply voltage range,
MSP430FG47x, during
program execution
4.15 MHz
Supply voltage range, MSP430FG47x,
during flash memory programming
1.8
2.2
2.5 3.6
Supply Voltage - V
Figure 1. Frequency vs Supply Voltage, Typical Characteristics
24
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