DRV8412_15 Datasheet, PDF (2/42 Pages) Texas Instruments – DRV84x2 Dual Full-Bridge PWM Motor Driver

DRV8412, DRV8432
SLES242G – DECEMBER 2009 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings ............................................................ 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information .................................................. 7
6.5 Package Heat Dissipation Ratings............................ 7
6.6 Package Power Deratings (DRV8412) ..................... 7
6.7 Electrical Characteristics........................................... 8
6.8 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 15
8 Application and Implementation ........................ 17
8.1 Application Information............................................ 17
8.2 Typical Applications ................................................ 17
9 Power Supply Recommendations...................... 24
9.1 Bulk Capacitance .................................................... 24
9.2 Power Supplies ....................................................... 24
9.3 System Power-Up and Power-Down Sequence ..... 25
9.4 System Design Recommendations ......................... 25
10 Layout................................................................... 27
10.1 Layout Guidelines ................................................. 27
10.2 Layout Example .................................................... 27
10.3 Thermal Considerations ........................................ 30
11 Device and Documentation Support ................. 32
11.1 Related Links ........................................................ 32
11.2 Trademarks ........................................................... 32
11.3 Electrostatic Discharge Caution ............................ 32
11.4 Glossary ................................................................ 32
12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (January 2014) to Revision G
Page
• Added ESD Ratingstable, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision E (October 2013) to Revision F
Page
• Changed GND_A, GND_B, GND_C, and GND_D pins description to remove text "requires close decoupling
capacitor to ground"................................................................................................................................................................ 4
• Changed the t_{ON_MIN} description to include "for charging the Bootstrap capacitor"................................................................ 6
• Added text to the Overcurrent (OC) Protection section - "It is important to note..." ............................................................ 13
Changes from Revision D (July 2011) to Revision E
Page
• Added last sentence in description of Thermal Pad in Pin Functions table. .......................................................................... 5
• Added THERMAL INFORMATION table ................................................................................................................................ 7
• Added a new paragraph in DIFFERENT OPERATIONAL MODES section: In operation modes.....DC logic level. ........... 15
Changes from Revision C (May 2010) to Revision D
Page
• Changed from 80 mΩ to 110 mΩ in first Feature ................................................................................................................... 1
• Changed from 50 V to 52 V in second Feature...................................................................................................................... 1
• Deleted (70 V Absolute Maximum) from second Feature ...................................................................................................... 1
• Added LED Lighting Drivers to Applications........................................................................................................................... 1
• Added Includes metallization bond wire and pin resistance to R_DS(on) test conditions ........................................................... 8
• Changed R_DS(on) typ from 80 mΩ to 110 mΩ .......................................................................................................................... 8
2
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