AMC7812SPAPR Datasheet, PDF (2/92 Pages) Texas Instruments – 12-Bit Analog Monitoring and Control Solution with Multichannel ADC, DACs, and Temperature Sensors

AMC7812
SBAS513E – JANUARY 2011 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
AMC7812
MAXIMUM
RELATIVE
ACCURACY
(LSB)
±1
PACKAGE/ORDERING INFORMATION⁽¹⁾
MAXIMUM
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
QFN-64
RGC
±1
HTQFP-64
PAP
SPECIFIED
TEMPERATURE
RANGE
–40°C to +105°C
–40°C to +105°C
PACKAGE
MARKING
AMC7812
AMC7812
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
AV_DD to GND
DV_DD to GND
IOV_DD to GND
AV_CC to GND
DV_DD to DGND
Analog input voltage to GND
ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND
D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND
Digital input voltage to DGND
SDO and DAV to GND
Operating temperature range
Storage temperature range
Junction temperature range (T_J max)
ESD ratings
Human body model (HBM)
Charged device model (CDM)
AMC7812
–0.3 to +6
–0.3 to +6
–0.3 to +6
–0.3 to +18
–0.3 to +6
–0.3 to AV_DD + 0.3
–0.3 to +6
–0.3 to AV_DD + 0.3
–0.3 to IOV_DD + 0.3
–0.3 to IOV_DD + 0.3
–40 to +105
–40 to +150
+150
2.5
1.0
UNIT
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
kV
kV
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
AMC7812
RGC (QFN)
PAP (HTQFP)
64 PINS
64 PINS
24.1
33.7
8.1
9.5
3.2
9.0
0.1
0.3
3.3
8.9
0.6
0.2
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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