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DM3730_10 Datasheet, PDF (1/268 Pages) Texas Instruments – Applications Processor
DM3730, DM3725
www.ti.com
DM3730, DM3725
Applications Processor
Check for Samples: DM3730, DM3725
SPRS685 – AUGUST 2010
1 DM3730, DM3725 Applications Processor
1.1 Features
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• DM3730/25 Applications Processor:
– Compatible with OMAP™ 3 Architecture
– MPU Subsystem
• Up to 1-GHz ARM CortexTM-A8 Core
• NEON SIMD Coprocessor
– High Performance Image, Video, Audio
(IVA2.2TM) Accelerator Subsystem
• Up to 800-MHz TMS320C64x+TM DSP Core
• Enhanced Direct Memory Access (EDMA)
Controller (128 Independent Channels)
• Video Hardware Accelerators
– POWERVR SGX™ Graphics Accelerator
(DM3730 only)
• Tile Based Architecture Delivering up to
20 MPoly/sec
• Universal Scalable Shader Engine:
Multi-threaded Engine Incorporating Pixel
and Vertex Shader Functionality
• Industry Standard API Support:
OpenGLES 1.1 and 2.0, OpenVG1.0
• Fine Grained Task Switching, Load
Balancing, and Power Management
• Programmable High Quality Image
Anti-Aliasing
– Advanced Very-Long-Instruction-Word
(VLIW) TMS320C64x+TM DSP Core
• Eight Highly Independent Functional
Units
• Six ALUs (32-/40-Bit); Each Supports
Single 32- bit, Dual 16-bit, or Quad 8-bit,
Arithmetic per Clock Cycle
• Two Multipliers Support Four 16 x 16-Bit
Multiplies (32-Bit Results) per Clock
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
Results) per Clock Cycle
• Load-Store Architecture With
Non-Aligned Support
• 64 32-Bit General-Purpose Registers
• Instruction Packing Reduces Code Size
• All Instructions Conditional
• Additional C64x+TM Enhancements
– Protected Mode Operation
– Expectations Support for Error
Detection and Program Redirection
– Hardware Support for Modulo Loop
Operation
– C64x+TM L1/L2 Memory Architecture
• 32K-Byte L1P Program RAM/Cache
(Direct Mapped)
• 80K-Byte L1D Data RAM/Cache (2-Way
Set- Associative)
• 64K-Byte L2 Unified Mapped RAM/Cache
(4- Way Set-Associative)
• 32K-Byte L2 Shared SRAM and 16K-Byte
L2 ROM
– C64x+TM Instruction Set Features
• Byte-Addressable (8-/16-/32-/64-Bit Data)
• 8-Bit Overflow Protection
• Bit-Field Extract, Set, Clear
• Normalization, Saturation, Bit-Counting
• Compact 16-Bit Instructions
• Additional Instructions to Support
Complex Multiplies
– External Memory Interfaces:
• SDRAM Controller (SDRC)
– 16, 32-bit Memory Controller With
1G-Byte Total Address Space
– Interfaces to Low-Power SDRAM
– SDRAM Memory Scheduler (SMS) and
Rotation Engine
• General Purpose Memory Controller
(GPMC)
– 16-bit Wide Multiplexed Address/Data
Bus
– Up to 8 Chip Select Pins With
128M-Byte Address Space per Chip
Select Pin
– Glueless Interface to NOR Flash,
NAND Flash (With ECC Hamming
Code Calculation), SRAM and
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POWERVR SGX is a trademark of Imagination Technologies Ltd.
2
OMAP is a trademark of Texas Instruments.
3
All other trademarks are the property of their respective owners.
4
PRODUCT PREVIEW information concerns products in the formative
or design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right
to change or discontinue these products without notice.
Copyright © 2010, Texas Instruments Incorporated