THCV215_16 Datasheet, PDF (23/26 Pages) THine Electronics, Inc. – V-by-One HS High-speed Video Data Transmitter and Receiver

7)Multi Drop Connection
Multi drop connection is not recommended.
THCV216
RLCLK0,1-
RLCLK0,1+
LVDS Rx
LVDS Rx
8)Multiple counterpart use
Multiple counterpart use such as following system is not recommended.
p.15 tTISK spec should be kept.
CLK
DATA
IC
CLK
DATA
LVDS Tx
LVDS Tx
TLCLK0-
TLCLK0+
TLCLK1-
TLCLK1+
THCV215
Asynchronous use such as following system is not recommended.
THCV216
RLCLK0-
RLCLK0+
RLCLK1-
RLCLK1+
LVDS Rx
LVDS Rx
CLK
DATA
IC
DATA
9)Multiple device connection
HTPDN and LOCKN signals are supposed to be connected proper for their purpose like the following figure.
HTPDN should be from just one Rx to multiple Tx because its purpose is only ignition of all Tx.
LOCKN should be connected so as to indicate that all Rx CDR become ready to receive normal operation data.
LOCKN of Tx side can be simply split to multiple Tx.
There can be other applicable circuits like ‘OR gate of LOCKN’, ‘npn transistor with resistors as inverter’, etc.
Also possible time difference of internal processing time (p.15 THCV215 tTCD and THCV216 tRDC) on
multiple data stream must be accommodated and compensated by the following destination device connected to
multiple THCV216, which may have internal FIFO.
THCV215
clkin.1
HTPDN
LOCKN
Source
Device
Ex. synchronized
THCV215
HTPDN
clkin.2 LOCKN
Internal processing time tTCD
THCV216
clkout.1
HTPDN
FIFO
LOCKN
PDN
Time diff. comes up
THCV216
Destination
Device
HTPDN
LOCKN clkout.2
FIFO
PDN
Internal processing time tRDC
THCV215-216_Rev.2.70_E
Copyright(C)2016 THine Electronics, Inc.
23/26
THine Electronics, Inc.
Security E