CGA3E2X7R2A103K080AA Datasheet, PDF (21/31 Pages) TDK Electronics – SPECIFICATION

No.
Process
7 Coating and
molding of the
P.C.board
8 Handling after
chip mounted
! Caution
Condition
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
1) Please pay attention not to bend or distort the P.C.board after soldering in handling
otherwise the chip capacitors may crack.
Bend
Twist
2) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item
Board
bending
Not recommended
Termination
peeling
Check pin
Recommended
Support pin
Check pin
9 Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
Crack
P.C.board
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