CGA3E2X7R2A103K080AA Datasheet, PDF (19/31 Pages) TDK Electronics – SPECIFICATION

No.
Process
Condition
5
Soldering
5-4. Avoiding thermal shock
1) _{Preheating condition}
Soldering
Type
Wave soldering
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA1(CC0201), CGA2(CC0402),
CGA3(CC0603), CGA4(CC0805),
Reflow soldering CGA5(CC1206)
CGA6(CC1210), CGA8(1812),
CGA9(CC2220)
Manual soldering
CGA1(CC0201), CGA2(CC0402),
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA6(CC1210), CGA8(1812),
CGA9(CC2220)
Temp. (°C)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
2) Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Excessive
solder
Higher tensile force in
chip capacitors to cause
crack
Adequate
Maximum amount
Minimum amount
Insufficient
solder
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
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