CGA3E2X7R2A103K080AA Datasheet, PDF (11/31 Pages) TDK Electronics – SPECIFICATION

Appendix - 1a
P.C. Board for reliability test
Applied for CGA1, CGA2, CGA3, CGA4, CGA5
100
c
Appendix - 1b
P.C. Board for reliability test
Applied for CGA6, CGA8, CGA9
100
c
Solder resist
Copper
(Unit：mm)
Appendix - 2a
P.C. Board for bending test
Applied for CGA1, CGA2
100
b
Slit
Solder resist Copper
(Unit : mm)
Appendix - 2b
P.C. Board for bending test
Applied for CGA3, CGA4, CGA5, CGA6, CGA8, CGA9
100
b
a
Solder resist
(Unit : mm)
a
b
Copper
Solder resist
Copper
(Unit : mm)
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a
Appendix-1a, 1b, 2b
0.8mm
1.6mm
Copper ( thickness 0.035mm )
Solder resist
TDK (EIA style)
CGA1(CC0201)
CGA2(CC0402)
CGA3(CC0603)
CGA4(CC0805)
CGA5(CC1206)
CGA6(CC1210)
CGA8(CC1812)
CGA9(CC2220)
Dimensions (mm)
a
b
c
0.3
0.8
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0 1.65
2.2
5.0
2.0
2.2
5.0
2.9
3.5
7.0
3.7
4.5
8.0
5.6
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