CGA3E2X7R2A103K080AA Datasheet, PDF (17/31 Pages) TDK Electronics – SPECIFICATION

No.
Process
4
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Recommended
Single sided
mounting
Crack
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
c
c
Example : CGA4 (CC0805), CGA5 (CC1206)
a
0.2mm min.
b
70 - 100μm
c
Do not touch the solder land
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