LSM303DLM Datasheet, PDF (36/38 Pages) STMicroelectronics – Sensor module:3-axis accelerometer and 3-axis magnetometer

Package information
10 Package information
LSM303DLM
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions, and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 5. LGA-28: mechanical data and package dimensions
Ref.
A1
A2
A3
D1
E1
L1
L2
N1
M
T1
T2
d
k
h
Dimensions
mm
Min.
Typ.
4.850
4.850
0.040
0.260
0.360
0.785
0.200
5.000
5.000
1.650
3.300
0.550
0.100
0.300
0.400
0.200
0.050
0.100
Max.
1
5.150
5.150
0.160
0.340
0.440
Outline and
mechanical data
LGA-28 (5x5x1)
Land Grid Array Packages
36/38
Doc ID 018725 Rev 1
8192208_B