LSM303DLM Datasheet, PDF (16/38 Pages) STMicroelectronics – Sensor module:3-axis accelerometer and 3-axis magnetometer

Application hints
LSM303DLM
6.2
Soldering information
The LGA package is compliant with the ECOPACK^®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “pin 1 indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
6.3
High current wiring effects
High current in the wiring and printed circuit traces can be the cause of errors in magnetic
field measurements for compassing.
Conductor-generated magnetic fields add to the Earth’s magnetic field, creating errors in
compass heading computation.
Keep currents that are higher than 10 mA a few millimeters further away from the sensor IC.
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Doc ID 018725 Rev 1