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STB4N62K3 Datasheet, PDF (3/18 Pages) STMicroelectronics – N-channel 620 V, 1.7 Ω, 3.8 A SuperMESH3 Power MOSFET
STB4N62K3, STD4N62K3
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
D²PAK
DPAK
VDS Drain-source voltage
VGS Gate- source voltage
ID Drain current (continuous) at TC = 25 °C
ID Drain current (continuous) at TC = 100 °C
IDM (1) Drain current (pulsed)
PTOT Total dissipation at TC = 25 °C
IAR
Avalanche current, repetitive or not-
repetitive (pulse width limited by Tj max)
Single pulse avalanche energy
EAS (starting Tj = 25°C, ID = IAR, VDD = 50V)
Gate source ESD(HBM-C = 100 pF,
VESD(G-S) R = 1.5 kΩ)
dv/dt (2) Peak diode recovery voltage slope
620
± 30
3.8
2
15.2
70
3.8
115
2500
12
VISO
Insulation withstand voltage (RMS) from
all three leads to external heat sink
(t = 1 s; TC = 25 °C)
Tstg Storage temperature
Tj Max. operating junction temperature
- 55 to 150
150
1. Pulse width limited by safe operating area.
2. ISD ≤ 3.8 A, di/dt = 400 A/µs, VDD = 80% V(BR)DSS, VDS peak ≤ V(BR)DSS.
Table 3. Thermal data
Symbol
Parameter
Rthj-case Thermal resistance junction-case max
Rthj-pcb (1) Thermal resistance junction-pcb max
1. When mounted on 1inch² FR-4 board, 2 oz Cu.
DPAK
1.79
50
Value
D²PAK
30
Unit
V
V
A
A
A
W
A
mJ
V
V/ns
V
°C
°C
Unit
°C/W
°C/W
Doc ID 18337 Rev 2
3/18