STM32F777XX Datasheet, PDF (251/255 Pages) STMicroelectronics – Dual mode Quad-SPI

STM32F777xx STM32F778Ax STM32F779xx
Package information
6.8
Thermal characteristics
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max x Θ_JA)
Where:
• T_A max is the maximum ambient temperature in °C,
• Θ_JA is the package junction-to-ambient thermal resistance, in °C/W,
• P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
• P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = Σ (V_OL × I_OL) + Σ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 135. Package thermal characteristics
Symbol
Parameter
Value
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
43
Thermal resistance junction-ambient
WLCSP180 - 0.4 mm pitch
30
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
40
Θ_JA
Thermal resistance junction-ambient
LQFP176 - 24 × 24 mm / 0.5 mm pitch
38
Thermal resistance junction-ambient
LQFP208 - 28 × 28 mm / 0.5 mm pitch
19
Thermal resistance junction-ambient
UFBGA176 - 10× 10 mm / 0.5 mm pitch
39
Thermal resistance junction-ambient
TFBGA216 - 13 × 13 mm / 0.8 mm pitch
29
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
DocID028294 Rev 4
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