STM32F777XX Datasheet, PDF (174/255 Pages) STMicroelectronics – Dual mode Quad-SPI

Electrical characteristics
STM32F777xx STM32F778Ax STM32F779xx
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 43 or Figure 44,
depending on whether V_REF+ is connected to V_DDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 43. Power supply and reference decoupling (V_REF+ not connected to V_DDA)
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1. V_REF+ input is available on all package whereas the V_REF– s available only on UFBGA176 and TFBGA216.
When V_REF- is not available, it isinternally connected to V_DDA and V_SSA.
Figure 44. Power supply and reference decoupling (V_REF+ connected to V_DDA)
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174/255
DLF
1. V_REF+ input is available on all package whereas the V_REF– s available only on UFBGA176 and TFBGA216.
When V_REF- is not available, it isinternally connected to V_DDA and V_SSA.
DocID028294 Rev 4