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STD85N10F7AG Datasheet, PDF (12/16 Pages) STMicroelectronics – High avalanche ruggedness | |||
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Package information
STD85N10F7AG
Figure 20. DPAK (TO-252) recommended footprint (a)
)3BB5
12/16
a. All dimensions are in millimeters
DocID027030 Rev 2
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