SKY65362-11 Datasheet, PDF (10/13 Pages) Skyworks Solutions Inc. – 900 to 930 MHz High-Power RF Front-End Module

DATA SHEET • SKY65362-11: HIGH-POWER RF FEM
Pin 36
Pin 1 Indicator
0.20 x 0.20
Pin 1
Stencil aperture size of 80% to 100%
of the module/package solder mask openings
9X 0.875 mm
Exposed center pads
Package Outline
6.3 mm
36X 0.75 mm
36X 0.25 mm
6.3 mm
9X 0.875 mm
0.125 mm Typ
0.5 mm Pitch
Stencil Aperture
Pin 36
Pin 1
Thermal via array
ø0.3 mm on 0.6 mm pitch
improves thermal performance
6.3 mm
34X 0.75 mm
34X 0.25 mm
0.6 mm Pitch
6.3 mm
Pin 36
Pin 1 Indicator
0.20 X 0.20
Pin 1
Opening size of 60% to 100%
of the exposed center
opening shown
6.4 mm
36X 0.85 mm
36X 0.4 mm
2X 1.4375 mm
6.4 mm
0.25 mm Typ
Package
Outline
0.6 mm Pitch
0.5 mm Pitch
Metallization
Notes:
1. All dimensions are in millimeters, unless otherwise specified.
2. Thermal vias should be resin filled and capped in accordance with IPC-4761Type VII vias.
Recommended Cu thickness is 30 to 35 µm.
Package
Outline
2X 1.4375 mm
0.5 mm Pitch
Solder Mask Opening
Figure 5. SKY65362-11 PCB Layout Footprint
Y1554
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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January 9, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202886B